SMP

SMP

The SMP series involves micro-miniature RF connectors with a snap coupling mechanism, suitable for use up to 12 GHz. The impedance is controlled at 50 Ohm. The mating faces are designed in accordance with the MIL-STD-348A specification. Cable terminations are either crimp or solder designs, for flexible and semi-rigid cables. The SMP series connectors are primarily used in high-speed signal transmission lines. Board-to-board PCB connections can be realised using the so-called SMP "bullets". There are three different coupling mchanisums: Smooth bore: Stiching contact Limited detent: Semi-fixed detent Full detent: Fixed detent


Mechanical Characteristics
Durability (mating cycles) Full Detent ≥ 100
Durability (mating cycles) Limited Detent ≥ 500
Durability (mating cycles) Smooth Bore ≥ 1000
Insertion force Full Detent 68 N max.
Insertion force Limited Detent 45 N max.
Insertion force Smooth Bore 9 N max.
Withdrawal force Full Detent 22 N min.
Withdrawal force Limited Detent 9 N min.
Withdrawal force Smooth Bore 2.2 N min.
Material: spring contacts CuBe2
Material: solid contact parts CuZn39Pb3
Material: crimp ferrule Cu
Material: insulators PTFE, LCP, PEEK
Finish: Inner conductor NiP-Au
Finish: Outer conductor NiP-Au
Finish: Other metal parts Ni-Au
Climatic Characteristics
Climatic category acc. to IEC 60068 - 1 55/155/21
Electrical Characteristics
Contact resistance inner conductor ≤ 6 mΩ
Contact resistance outer conductor ≤ 2 mΩ
Insulation resistance ≥ 5 GΩ
Impedance 50 Ω
Frequency range up to 12 GHz
VSWR: Straight style, semi-rigid typ. 1.03+0.02 f (GHz)
VSWR: Angle style, semi-rigid typ. 1.04+0.03 f (GHz)
Proof voltage 500 Veff/50 Hz
Working voltage ≤ 335 Veff/50 Hz
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